| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board manufacturing method which can improve yield by enabling accurate formation of a through hole even when an inner diameter of the through hole is small.SOLUTION: A wiring board of the present embodiment is manufactured through a base material preparation process, a base material placement process and a through hole formation process. In the base material preparation process, a base material 45 having a first surface 46 and a second surface 47 is prepared. In the base material placement process, the base material 45 is placed on a support surface 50 of a support member 49 in a state where the first surface 46 faces the support surface 50 and a light-permeable protection layer 51 is sandwiched between the base material 45 and the support member 49. In the through hole formation process, through holes 26 each of which pierces the base material 45 in a thickness direction by irradiation of laser beams L1. Note that, a hole 53 is provided in the support member 49. An inner diameter A2 of the hole 53 is set at equal to or larger than an inner diameter A1 of each through hole 26 and less than a pitch A3 between adjacent through holes 26. |
