发明名称 DICING DEVICE AND DICING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a dicing device and a dicing method capable of performing kerf checking of a groove processed to all processing lines in real time with accuracy without reducing throughput.SOLUTION: A dicing device comprises: a work table 12 for holding a work-piece W; a blade 14 for processing the work-piece W; a table moving mechanism 22 for relatively moving the work table 12 to the blade 14; a microscope 18 arranged at a downstream side in a work-piece movement direction, of the blade 14, and provided for observing a surface of the work-piece W in a state where liquid is interposed between the surface of the work-piece W and itself. This microscope 18 has a line camera in which a plurality of light receiving elements are arranged in a line in a direction vertical to the work-piece movement direction, and consecutively captures an optical image of the surface of the work-piece W in the work-piece movement direction.
申请公布号 JP2016009751(A) 申请公布日期 2016.01.18
申请号 JP20140129165 申请日期 2014.06.24
申请人 TOKYO SEIMITSU CO LTD 发明人 UEKIHARA AKIRA;HAYASHI HIROKAZU
分类号 H01L21/301;B23K26/00;B23K26/146;B23K26/364 主分类号 H01L21/301
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