| 摘要 |
PROBLEM TO BE SOLVED: To provide: a method for manufacturing a wiring board which is arranged so as to prevent a damage to a glass base by reducing a load to be applied to an end portion of a glass base in a process for manufacturing a glass interposer (a wiring board), taking into account of a glass base side structure; and a manufacturing facility therefor.SOLUTION: A method for manufacturing a wiring board comprises: an insulative resin layer formation step for covering a glass base 10 with an insulative resin layer 12 of 3-200 ppm/K in a range of 150-240°C of a linear expansion coefficient and a PET film 11 so that the glass base 10 is included by them; a sprocket hole formation step for providing sprocket holes 13 extending from the glass base 10 in a part where the PET film 11 and the insulative resin layer 12 are laminated; and a film-peeling step for peeling the PET film 11 on the glass base 10, thereby exposing an insulative resin part after hardening of the insulative resin layer 12. |
