| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a wiring board, by which reliability can be improved by preventing displacement of a spherical terminal.SOLUTION: A wiring board of the present invention is manufactured through a substrate preparation step, a solder paste supply step, a spherical terminal disposition step, and a reflow step. In the substrate preparation step, a first substrate 11 is prepared. In the solder paste supply step, a solder paste is supplied onto an electrode 65 in an opening 59 that penetrates in a thickness direction of a solder resist layer 57. In the spherical terminal disposition step, a spherical terminal 81 is disposed on the electrode 65 where the solder paste has been supplied in such a manner that only a lower part of the terminal touches the solder paste while other part is exposed. In the reflow step, the solder paste is fused by heating to change into a solder 99 in a liquid phase, and thereby the entire surface of the spherical terminal 81 is covered with the solder 99. |
