| 摘要 |
A chemical mechanical polishing apparatus according to the present invention comprises: a polishing pad which is positioned on a plate; a polishing head which is positioned on the polishing pad; a retainer ring which is installed to prevent a wafer from deviating from a lower circumference of the polishing head during a polishing process, and includes an upper retaining member assembled with the polishing head and a lower retaining member coupled to the upper retaining member; an elasticity reinforcement unit which is installed in the lower retaining member to suppress fracture of the retainer ring. The lower retaining member includes a placement unit on which the upper retaining member is placed and mounted, an outer ring unit which is formed on the outside of the placement unit, an inner ring unit which is installed on the inside of the placement unit, and a local pressure applying unit which is installed along the inner circumference of the inner ring unit to avoid the contact with the outer ring unit. The elasticity reinforcement unit is installed to be fitted into the local pressure applying unit. |
