| 摘要 |
PROBLEM TO BE SOLVED: To provide a ceramic electronic component having high reliability in which crack hardly occurs at a portion corresponding to a roundabout tip portion of an external electrode of a ceramic element assembly on which stress most concentrates during a deflective test, a bending test, a reflow multiple passing test, a heat cycle test or the like.SOLUTION: In a ceramic electronic component which has a ceramic element assembly 10 having an internal electrode 2 (2a, 2b) and is configured so that the internal electrodes are drawn out to the end face 3 (3a, 3b), and an external electrode 4 (4a, 4b) which is conducted to the internal electrode drawn to the end face of the ceramic assembly and formed at the end portion of the ceramic element assembly so as to go around from the end face 3 of the ceramic element assembly to the side surface 15, a resin layer 20 is made to exist between the tip area 14a of the roundabout portion 14 of the external electrode which goes around to the side surface of the ceramic element assembly and the surface of the ceramic element assembly (the gap 21). A Ni plating film layer 12 having a stress of 40 MPa or less is provided to the surface of the external electrode. |
