发明名称 SEMICONDUCTOR STORAGE DEVICE MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor storage device excellent in shape control of a laminate.SOLUTION: A semiconductor storage device manufacturing method comprises the step of simultaneously forming by dry etching using a mask layer formed on a laminate, first slits for shaping a part of a laminate having a plurality of layers of first processed films and a plurality of layers of second processed films each arranged in each gap between the first processed films to comb-shaped patterns each having a plurality of line parts and second slits for surrounding the comb-shaped patterns by a closed pattern.
申请公布号 JP2016009738(A) 申请公布日期 2016.01.18
申请号 JP20140128830 申请日期 2014.06.24
申请人 TOSHIBA CORP 发明人 HASHIMOTO JUNICHI;YAHASHI KATSUNORI;ICHINOSE DAIGO;IGUCHI SUNAO
分类号 H01L21/8247;H01L21/336;H01L27/115;H01L29/788;H01L29/792 主分类号 H01L21/8247
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