| 摘要 |
PROBLEM TO BE SOLVED: To provide a scribe device that can scribe an end material region of a substrate along a planned scribe line without being intervened by a chuck claw even if a width of the end material region is almost as small as a gripping margin of the chuck claw.SOLUTION: The scribe device, which comprises a loader A that transfers a substrate W from a first position to a second position on a downstream side in a conveying direction of the substrate, and a holding/conveying unit B that conveys the substrate to a scribe unit C arranged on the downstream side while holding with a chuck claw 11 an end part on an upstream side of the substrate W transferred to the second position, scribes a planned scribe line S2 in a Y-direction on a surface of the substrate W conveyed to the scribe unit C with a cutter wheel 23 of the scribe unit C. The loader A comprises adsorbing/conveying member 2 for picking up the substrate W, and the loader A can be moved in an X-direction together with the adsorbing/conveying member 2. |
