发明名称 |
MOUNTING SUBSTRATE AND METHOD FOR MANUFACTURING MOUNTING SUBSTRATE |
摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a mounting substrate having reflection characteristics while suppressing damage to a resin substrate.SOLUTION: The method for manufacturing a mounting substrate comprises the steps of: preparing a wiring board including the resin substrate having flexibility and an electrode unit for mounting provided on the resin substrate; and mounting a light-emitting component on the electrode unit for mounting of the wiring board. The method further includes a reflection characteristic imparting step of providing a reflective member reflecting light on a surface on the side on which the light-emitting component is mounted among surfaces of the wiring board before or after the mounting step. The reflection characteristic imparting step is performed by sticking a reflective member including an opening formed in the position corresponding to the light-emitting component to the wiring board via an adhesive layer. |
申请公布号 |
JP2016009690(A) |
申请公布日期 |
2016.01.18 |
申请号 |
JP20140127521 |
申请日期 |
2014.06.20 |
申请人 |
DAINIPPON PRINTING CO LTD |
发明人 |
HONMA SATOSHI |
分类号 |
H01L33/62;F21S2/00;H01L23/12;H01L23/14;H01L33/00 |
主分类号 |
H01L33/62 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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