发明名称 MOUNTING SUBSTRATE AND METHOD FOR MANUFACTURING MOUNTING SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a method for manufacturing a mounting substrate having reflection characteristics while suppressing damage to a resin substrate.SOLUTION: The method for manufacturing a mounting substrate comprises the steps of: preparing a wiring board including the resin substrate having flexibility and an electrode unit for mounting provided on the resin substrate; and mounting a light-emitting component on the electrode unit for mounting of the wiring board. The method further includes a reflection characteristic imparting step of providing a reflective member reflecting light on a surface on the side on which the light-emitting component is mounted among surfaces of the wiring board before or after the mounting step. The reflection characteristic imparting step is performed by sticking a reflective member including an opening formed in the position corresponding to the light-emitting component to the wiring board via an adhesive layer.
申请公布号 JP2016009690(A) 申请公布日期 2016.01.18
申请号 JP20140127521 申请日期 2014.06.20
申请人 DAINIPPON PRINTING CO LTD 发明人 HONMA SATOSHI
分类号 H01L33/62;F21S2/00;H01L23/12;H01L23/14;H01L33/00 主分类号 H01L33/62
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