| 摘要 |
PROBLEM TO BE SOLVED: To provide a positive photosensitive adhesive composition which can expand the tolerance of the film thickness of a patterning positive photosensitive adhesive and exhibit appropriate fluidity during connection in connection between semiconductor chips or connection between the semiconductor chip and a support member for mounting the semiconductor chip and further has little voids, and to provide an adhesive pattern, a semiconductor wafer with an adhesive layer and a semiconductor device using the same.SOLUTION: There is provided a positive photosensitive adhesive composition which comprises (A) an alkali-soluble resin, (B) a compound for generating an acid by light, (C) a thermal crosslinking agent, (D) a curing accelerator and (E) a compound having a phenolic hydroxyl group. There is provided an adhesive pattern obtained by exposing an adhesive layer composed of the positive photosensitive adhesive composition laminated on an adherend and subjecting the adhesive layer after exposure to development processing with an alkaline developer. There is provided a semiconductor wafer with an adhesive layer comprising a semiconductor wafer and an adhesive layer composed of the positive photosensitive adhesive composition laminated on the semiconductor wafer. |
