| 摘要 |
A COVER TAPE (1) FOR PACKAGING ELECTRONIC COMPONENTS THAT CAUSES NO CONTAMINATION OF SEALING BAR BY THE OUTFLOW OF CUSHION LAYER (3) AND ATTAINS SUPERIOR ADHESION CHARACTERISTIC WITH THE CARRIER TAPE (8) IS PROVIDED. A COVER TAPE (1) FOR PACKAGING ELECTRONIC COMPONENTS HEAT-SEALABLE TO A CARRIER TAPE (8) FOR PACKAGING ELECTRONIC COMPONENTS, COMPRISING AT LEAST A BASE LAYER (2), A CUSHION LAYER (3) FORMED OF RESIN A, A HEAT-SEAL FOLLOWING LAYER (4) FORMED OF RESIN B AND A HEAT-SEALING LAYER (5) LAMINATED IN THIS ORDER; WHEREIN VICAT SOFTENING TEMPERATURE TA OF SAID RESIN A MEASURED IN ACCORDANCE WITH ISO 306 (RATE OF TEMPERATURE INCREASE: 50°C/HOUR, LOAD: 10N) AND VICAT SOFTENING TEMPERATURE TB OF SAID RESIN B MEASURED IN ACCORDANCE WITH ISO 306 (RATE OF TEMPERATURE INCREASE: 50°C/HOUR, LOAD: 10N) SATISFY THE RELATIONAL EXPRESSION 1 BELOW; AND THICKNESS OF SAID HEAT-SEAL FOLLOWING LAYER (4) IS NOT SMALLER THAN 2 ?M AND NOT LARGER THAN 15 ?M: RELATIONAL EXPRESSION 1: TA ? TB ? 3(°C). |
