| 摘要 |
The reliability of decoding a code, formed in a semiconductor device, is improved. An embodiment includes a process of forming a seal (MR) in a plurality of device areas (DVP) while a code (first identification information) (MK3) is formed on the outside of the device areas (DVP) of a wiring substrate. Moreover, an embodiment includes a process of decoding the code (MK3) after forming the seal (MR) to form another code (second identification information) in the seal (MR). Furthermore, a dam part (DM) is formed between the device areas (DVP) and a marking area in which the code (MK3) is formed, even prior to the process of forming the seal (MR). |
