| 摘要 |
The present invention relates to a substrate treating device. According to an embodiment of the present invention, the substrate treating device comprises: a housing; a cup which is located in the housing and which has a treating space therein; a substrate support unit which supports a substrate in the housing; a treating fluid supply unit which is located on an external side of the cup and which supplies a treating fluid onto an upper surface of the substrate; and an air current supply unit which supplies external air for forming a descending air current in the housing. The air current supply unit comprises: an inner spray plate which supplies an air current to the treating space; and an outer spray plate which surrounds the inner spray plate and supplies an air current to the external side of the cup. |
