发明名称 WIRING MODULE
摘要 A wiring module (49) that comprises: a wiring board (69); a base part (38) that has the wiring board (69) arranged thereupon; and an adhesion layer (59) that adheres the wiring board (69) to the base part (38). The wiring board (69) includes: a land part (60) that has a power generation element (19) mounted thereon; and a wiring part (63) that is electrically connected to the power generation element (19). The adhesion layer (59) has: a land adhesion region (50) that adheres the land part (60) to the base part (38); and a wiring adhesion region (53) that adheres the wiring part (63) to the base part (38). The width of the wiring adhesion region (53) is smaller than the width of the land adhesion region (50).
申请公布号 WO2016006570(A1) 申请公布日期 2016.01.14
申请号 WO2015JP69407 申请日期 2015.07.06
申请人 SUMITOMO ELECTRIC INDUSTRIES, LTD. 发明人 TOYA,KAZUMASA;IWASAKI,TAKASHI;NAGAI,YOUICHI;MORI,KOJI;SAITO,KENJI;MIKAMI,RUI;YAMANA,TAKESHI
分类号 H01L31/05;H01L31/054 主分类号 H01L31/05
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