RAW MATERIAL POLYIMIDE RESIN FOR FORMATION OF ADHESIVE LAYER OF COVERLAY FILM

摘要

PROBLEM TO BE SOLVED: To provide polyimide resin which does not generate a volatile component formed of a cyclic siloxane compound, and does not reduce adhesive force between a wiring layer and a coverlay film even under a use environment subjected to high temperature repeatedly.SOLUTION: Provided is the polyimide resin obtained by reaction of an acid anhydride component including an aromatic tetracarboxylic acid anhydride expressed by the formula (3) and a diamine component including aliphatic diamine derived from dimer acid.