| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin substrate with a support substrate in which troubles do not occur during the peeling of the resin substrate even when a mechanical peeling method is used, by focusing on the C=O bond of the resin substrate and lowering the adhesive strength between the support substrate and the resin substrate.SOLUTION: There is provided a resin substrate with a support substrate including a support substrate 2, a release layer 3 disposed on the support substrate 2 and comprising metal oxide, and a resin substrate 4 disposed on the release layer 3, and in which the resin material constituting the resin substrate 4 comprises C=O bond and, in the resin substrate 4, the abundance ratio of C=O bond of the rear surface region R on the side in contact with the release layer 3 is lower than the abundance ratio of C=O bond of the front surface region F on the side opposite to the release layer 3. |
