SUBSTRATE POLISHING APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a substrate polishing apparatus which can efficiently prevent gas diffusion near a generation point of a harmful gas.SOLUTION: A substrate polishing apparatus comprises: a rotatable polishing table 30; a top ring 31 for holding a wafer W and polishing the wafer W by pushing the wafer W to the polishing table 30; and a local exhaust system 35 having an air intake head 36 arranged near the top ring 31. The air intake head 36 is arranged on the downstream side of a rotation direction of the polishing table 30 with respect to the top ring 31.