发明名称 |
CIRCUIT BOARD |
摘要 |
This wiring board is provided with: a plurality of metal wires disposed upon an insulating substrate; and a transparent adhesive agent layer which is disposed upon the metal wires, and which is in direct contact with the metal wires. The metal wires include: a first metal wire which has a pulse signal supplied thereto; and a second metal wire which has a fixed electric potential applied thereto. The pulse signal has a reference level identical to the fixed electric potential, and has a pulse train in which a plurality of pulses having a pulse width of not more than 3 msec are arranged, the integral time of the pulses in a period of 600 seconds being less than 60 seconds. |
申请公布号 |
US2016014894(A1) |
申请公布日期 |
2016.01.14 |
申请号 |
US201514864895 |
申请日期 |
2015.09.25 |
申请人 |
FUJIFILM CORPORATION |
发明人 |
ENDO YASUSHI;TADA NOBUYUKI;NAOI KENJI;ASAI TOMOHITO;IKEDA HIDEO;SHIBATA MICHIHIRO |
分类号 |
H05K1/11;H05K1/09 |
主分类号 |
H05K1/11 |
代理机构 |
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代理人 |
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主权项 |
1. A circuit board having a plurality of metal interconnects disposed on an insulating base and a transparent adhesive layer disposed on the metal interconnects in direct contact with the metal interconnects, wherein
the metal interconnects include: first metal interconnects to which a pulse signal is supplied; and second metal interconnects to which a fixed potential is applied; and the pulse signal has a pulse train of a plurality of pulses whose reference level is the same as the fixed potential and which have a pulse duration of 3 milliseconds or shorter, and an integrated time of the pulses during 600 seconds is less than 60 seconds. |
地址 |
TOKYO JP |