发明名称 CIRCUIT BOARD
摘要 This wiring board is provided with: a plurality of metal wires disposed upon an insulating substrate; and a transparent adhesive agent layer which is disposed upon the metal wires, and which is in direct contact with the metal wires. The metal wires include: a first metal wire which has a pulse signal supplied thereto; and a second metal wire which has a fixed electric potential applied thereto. The pulse signal has a reference level identical to the fixed electric potential, and has a pulse train in which a plurality of pulses having a pulse width of not more than 3 msec are arranged, the integral time of the pulses in a period of 600 seconds being less than 60 seconds.
申请公布号 US2016014894(A1) 申请公布日期 2016.01.14
申请号 US201514864895 申请日期 2015.09.25
申请人 FUJIFILM CORPORATION 发明人 ENDO YASUSHI;TADA NOBUYUKI;NAOI KENJI;ASAI TOMOHITO;IKEDA HIDEO;SHIBATA MICHIHIRO
分类号 H05K1/11;H05K1/09 主分类号 H05K1/11
代理机构 代理人
主权项 1. A circuit board having a plurality of metal interconnects disposed on an insulating base and a transparent adhesive layer disposed on the metal interconnects in direct contact with the metal interconnects, wherein the metal interconnects include: first metal interconnects to which a pulse signal is supplied; and second metal interconnects to which a fixed potential is applied; and the pulse signal has a pulse train of a plurality of pulses whose reference level is the same as the fixed potential and which have a pulse duration of 3 milliseconds or shorter, and an integrated time of the pulses during 600 seconds is less than 60 seconds.
地址 TOKYO JP