发明名称 DUAL STI INTEGRATED CIRCUIT INCLUDING FDSOI TRANSISTORS AND METHOD FOR MANUFACTURING THE SAME
摘要 An integrated circuit, including: a first cell, including: FDSOI transistors; a UTBOX layer lying beneath the transistors; a first well lying beneath the insulator layer and beneath the transistors, the first well having a first type of doping; a first ground plane having a second type of doping, located beneath one of the transistors and between the insulator layer and the first well; a first STI separating the transistors and crossing the insulator layer; a first conductive element forming an electrical connection between the first well and the first ground plane, located under the first STI; a second cell including a second well; a second STI separating the cells, crossing the insulator layer and reaching the bottom of the first and second wells.
申请公布号 US2016013205(A1) 申请公布日期 2016.01.14
申请号 US201314771025 申请日期 2013.02.28
申请人 COMMISSARIAT À L'ÉNERGIE ATOMIQUE ET AUX ÉNERGIES ALTERNATIVES ;INTERNATIONAL BUSINESS MACHINES CORPORATION ;STMICROELECTRONICS, INC. 发明人 VINET Maud;CHENG Kangguo;DORIS Bruce;GRENOUILLET Laurent;KHAKIFIROOZ Ali;LE TIEC Yannick;LIU Qing
分类号 H01L27/12;H01L21/84;H01L21/8238;H01L29/06 主分类号 H01L27/12
代理机构 代理人
主权项
地址 Paris FR