| 摘要 |
The present invention relates to a thick film pattern structure and a method for forming same, in which a lamination step is repeated, thereby gradually reducing, during formation, the width of the thick film pattern that is being formed, and thus identical material layers are laminated, thereby reducing the taper angle in a region at the edge of the pattern in which all the layers have been laminated. The thick film pattern comprises a thick film pattern coating layer having any one pattern width, and different thick film pattern coating layers which are laminated on the thick film pattern coating layer in order such that the width of the pattern gradually decreases from the edge region of the thick film pattern coating layer, the thick film pattern formed by the thick film pattern coating layers having a stepped shape. |
