发明名称 |
METHODS OF FORMING HIGH ASPECT RATION PLATED THROUGH HOLES AND HIGH PRECISION STUB REMOVAL IN A PRINTED CIRCUIT BOARD |
摘要 |
<p>The present invention relates to printed circuit boards (PCBs), and more particularly, to methods of forming high aspect ratio through holes and high precision stub removal in a printed circuit board (PCB). The high precision stub removal processes may be utilized in removing long stubs and short stubs. In the methods, multiple holes of varying diameter and depth are drilled from an upper and/or lower surface of the printed circuit board utilizing drills of different diameters.</p> |
申请公布号 |
WO2015112758(A9) |
申请公布日期 |
2016.01.14 |
申请号 |
WO2015US12523 |
申请日期 |
2015.01.22 |
申请人 |
SANMINA CORPORATION |
发明人 |
THOMAS, DOUGLAS, WARD;IKETANI, SHINICHI;KERSTEN, DALE |
分类号 |
H05K3/40;H05K3/42 |
主分类号 |
H05K3/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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