| 摘要 |
Disclosed is an electronic device with a contactless temperature sensor. The electronic device with a contactless temperature sensor comprises the following: a solidity circuit substrate, located inside, having at least one electron element and including an input and output element; a flexible circuit substrate of which one end is electrically connected to the input and output element and of which the other end includes a connection element for a sensor package; a contactless temperature sensor package which includes a sensor base substrate connected to the other end of the flexible circuit substrate, a cover housing forming a sealed package space by being combined with the sensor base substrate, a contactless temperature sensor chip inside the package space by being mounted on one side of the sensor base substrate, and a lens combined to a lens combination hole of the cover housing, and which is arranged separately from the solidity circuit substrate; and an outer housing which accommodates the temperature sensor package and the other end of the flexible circuit substrate inside, forming an entrance hole of which a part facing the lens is opened, and of which the outer surface is combined to the case of the electronic device. The temperature sensor package and the outer housing are combined via a resin material filled between the same, not to touch each other directly by being separately arranged. |
