摘要 |
Disclosed is a three-dimensional wafer surface washing device for removing foreign substances present on the surface of a three-dimensional wafer having a three-dimensional structure formed on the surface thereof. The three-dimensional wafer surface washing device comprises: a wafer support part for supporting a three-dimensional wafer; and a CO2 dry ice spray unit forming, in a washing nozzle or in the vicinity thereof, solid CO2 dry ice through the adiabatic expansion of liquid CO2, and spraying the solid CO2 dry ice at a surface of the three-dimensional wafer through the washing nozzle, wherein the CO2 dry ice spray unit includes a liquid CO2 supply part for supplying the liquid CO2 to the washing nozzle, and an accelerated clean air supply part for supplying clean air to the washing nozzle. |