发明名称 CURABLE RESIN COMPOSITION AND SUBSTRATE END PROTECTION AGENT
摘要 PROBLEM TO BE SOLVED: To provide a curable resin composition capable of obtaining a substrate end protection agent having excellent adhesiveness and an excellent effect of improving the impact resistance of a substrate end part, and to provide a substrate end protection agent obtained by using the curable resin composition.SOLUTION: A curable resin composition contains: a thioether oligomer having a thiol group and/or a carbon-carbon double bond; a monofunctional polymerizable monomer having one reactive functional group, capable of reacting with the thiol group and/or carbon-carbon double bond of the thioether oligomer, in one molecule; a polyfunctional epoxy (meth)acrylate; and a radical polymerization initiator. The content of the polyfunctional epoxy (meth)acrylate is 0.1-5 pts.wt. based on 100 pts.wt. of the total of the thioether oligomer, the monofunctional polymerizable monomer, and the polyfunctional epoxy (meth)acrylate.
申请公布号 JP2016006144(A) 申请公布日期 2016.01.14
申请号 JP20140127449 申请日期 2014.06.20
申请人 SEKISUI CHEM CO LTD 发明人 KUNIHIRO YOSHITAKA;MATSUDA MASANORI
分类号 C08G75/04;C08F2/44;C08F290/06 主分类号 C08G75/04
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