发明名称 PACKAGING CONCEPT TO IMPROVE PERFORMANCE OF A MICRO-ELECTRO MECHANICAL (MEMS) MICROPHONE
摘要 A size of a port hole in a package for a micro-electro-mechanical (MEMS) microphone can be modified to improve performance of the MEMS microphone while protecting the MEMS microphone from environmental interference. As an example, the port hole diameter is increased along a thickness of a substrate coupled to the MEMS microphone to reduce air mass loading and air flow resistance and thus, increase the resonant frequency, resonant peak, signal-to-noise ratio (SNR) and/or a range for flat frequency response of the MEMS microphone. In one aspect, the port hole can be created by mechanical and/or laser drilling. In another aspect, the port hole can be created by forming a cavity in the substrate over a drilled port hole.
申请公布号 US2016014530(A1) 申请公布日期 2016.01.14
申请号 US201414330788 申请日期 2014.07.14
申请人 INVENSENSE, INC. 发明人 Gao Jia
分类号 H04R23/00 主分类号 H04R23/00
代理机构 代理人
主权项 1. A device, comprising: a micro-electro-mechanical (MEMS) microphone device; and a substrate, coupled to the MEMS microphone device, having a top surface and a bottom surface, wherein the MEMS microphone device is coupled to the top surface, the substrate comprises a port hole that has a first diameter at a first position closer to the top surface and a second diameter at a second position closer to the bottom surface, and wherein the first diameter is larger than the second diameter.
地址 San Jose CA US