发明名称 THERMALLY CONDUCTIVE RESIN COMPOSITION AND MOLDED ARTICLE COMPRISING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a thermally conductive resin composition having excellent mechanical properties and impact resistance.SOLUTION: A thermally conductive resin composition comprises polyamide resin (A), thermally conductive filler (B), and aramid fiber (C), wherein a mass ratio between polyamide resin (A) and thermally conductive filler (B), (A/B), is 15/85-80/20, and the content of aramid fiber (C) is 3-30 pts. mass relative to 100 pts. mass of polyamide resin (A) and thermally conductive filler (B) in total.
申请公布号 JP2016006146(A) 申请公布日期 2016.01.14
申请号 JP20140157689 申请日期 2014.08.01
申请人 UNITIKA LTD 发明人 KAIBARA SUSUMU;ITO AKIRA;FURUKAWA MIKIO
分类号 C08L77/00;C08K3/34;C08K7/02;C08L93/04 主分类号 C08L77/00
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