BONDED ASSEMBLY WITH INTEGRATED TEMPERATURE SENSING IN BOND LAYER

摘要

An assembly, for example an electrostatic chuck, is provided including a substrate, an electrostatic chuck, a heating plate, and a bond layer comprising a phosphorescent material. In one form, an optical sensor is disposed proximate the bond layer to detect a temperature of the bond layer in the field of view of the optical sensor. The phosphorescent material is illuminated and the subsequent decay is observed by the optical sensor. From this information, the temperature of the electrostatic chuck and substrate is determined and heating elements may be adjusted by a controller.

主权项

1. An assembly comprising:
a first member; a second member disposed proximate the first member; a bond layer disposed between the first member and the second member, the bond layer securing the second member to the first member and comprising a phosphorescent material; and at least one optical sensor disposed proximate the bond layer to detect a temperature of the bond layer in a field of view of the optical sensor.