LEAD FRAME MULTIPLE-PATTERN BODY, LEAD FRAME MULTIPLE-PATTERN BODY PROVIDED WITH RESIN, SEMICONDUCTOR DEVICE MULTIPLE-PATTERN BODY, PRODUCTION METHOD FOR LEAD FRAME MULTIPLE-PATTERN BODY PROVIDED WITH RESIN, INJECTION-MOLDING MOLD FOR USE IN SAME, MOLDING DEVICE

摘要

Provided is a lead frame multiple-pattern body wherein an unnecessary section of resin that is formed upon a frame body can be easily removed. Also provided are a lead frame multiple-pattern body provided with a resin, a semiconductor device multiple-pattern body, a production method for a lead frame multiple-pattern body provided with a resin, an injection-molding mold for use in the production method, and a molding device. A lead frame multiple-pattern body (MS) wherein a lead frame (10) is formed as a multiple pattern inside a frame body (F) and is filled with a resin from one surface side of the lead frame (10), the lead frame multiple-pattern body (MS) being characterized in that a through hole (H) is formed in the frame body (F) so as to pass from one surface side of the frame body (F) to the other surface side, and in that an opening part of the through hole (H) is formed so as to gradually narrow heading from the one surface side of the frame body (F) to the other surface side.