发明名称 |
COMPOSITION FOR ADHESION |
摘要 |
PROBLEM TO BE SOLVED: To provide a composition for adhesion that has high adhesiveness and prevents the release of formaldehyde.SOLUTION: A composition for adhesion is cured by heating/pressurization. The composition for adhesion contains polycarboxylic acid having a plurality of carboxyl groups in the molecule, and a furan compound. |
申请公布号 |
JP2016006195(A) |
申请公布日期 |
2016.01.14 |
申请号 |
JP20150155215 |
申请日期 |
2015.08.05 |
申请人 |
PANASONIC IP MANAGEMENT CORP |
发明人 |
SUGAWARA AKIRA;UMEMURA KENJI |
分类号 |
C09J167/00;B27K5/00;C09J5/06;C09J11/04;C09J11/06;C09J11/08;C09J167/06 |
主分类号 |
C09J167/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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