发明名称 COMPOSITION FOR ADHESION
摘要 PROBLEM TO BE SOLVED: To provide a composition for adhesion that has high adhesiveness and prevents the release of formaldehyde.SOLUTION: A composition for adhesion is cured by heating/pressurization. The composition for adhesion contains polycarboxylic acid having a plurality of carboxyl groups in the molecule, and a furan compound.
申请公布号 JP2016006195(A) 申请公布日期 2016.01.14
申请号 JP20150155215 申请日期 2015.08.05
申请人 PANASONIC IP MANAGEMENT CORP 发明人 SUGAWARA AKIRA;UMEMURA KENJI
分类号 C09J167/00;B27K5/00;C09J5/06;C09J11/04;C09J11/06;C09J11/08;C09J167/06 主分类号 C09J167/00
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