3-D INTEGRATED PACKAGE

摘要

In an example embodiment, an electronics package includes one or more insulating layers and an electrically conductive transmission line. The electrically conductive transmission line includes a signal trace disposed substantially parallel to the one or more insulating layers. The electrically conductive transmission line further includes one or more signal vias electrically coupled to the signal trace. The one or more signal vias are configured to pass through at least a portion of the one or more insulating layers. The electronics package further includes one or more electrically conductive ground planes substantially parallel to the one or more insulating layers. The ground planes include one or more signal via ground cuts. The one or more signal via ground cuts provide clearance between the one or more signal vias and the one or more ground planes.

主权项

1. An electronics package comprising:
a plurality of transition layers, each transition layer including:
an insulating layer;a signal via configured to pass through the insulating layer and that is electrically coupled with the signal via of an adjacent transition layer;a ground plane having a signal cut configured to provide clearance between the ground plane and the signal via; anda plurality of ground vias each configured to electrically couple the ground plane of the transition layer with the ground plane of an adjacent transition layer; an electrically conductive transmission line including:
a coplanar waveguide portion electrically coupled to a microstrip portion;the signal vias of the plurality of transition layers; anda signal pin electrically coupled to the signal vias, wherein the signal pin is configured to be electrically coupled to a printed circuit board (PCB) via a PCB signal trace deposited on the PCB.