| 发明名称 |
Methods of Packaging Semiconductor Devices and Packaged Semiconductor Devices |
| 摘要 |
Methods of packaging semiconductor devices and packaged semiconductor devices are disclosed. In some embodiments, a method of packaging a semiconductor device includes forming a dam structure on dies proximate edge regions of the dies. A molding material is disposed around the dies, and a top portion of the molding material and a top portion of the dam structure are removed. |
| 申请公布号 |
US2016013152(A1) |
申请公布日期 |
2016.01.14 |
| 申请号 |
US201414326228 |
申请日期 |
2014.07.08 |
| 申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Yu Chen-Hua;Liu Chung-Shi;Chen Meng-Tse;Huang Hui-Min;Huang Chih-Fan;Cheng Ming-Da |
| 分类号 |
H01L25/065;H01L21/56;H01L21/3105;H01L21/768;H01L23/528;H01L21/78;H01L21/683;H01L23/31;H01L23/58;H01L25/00;H01L23/00 |
主分类号 |
H01L25/065 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of packaging a semiconductor device, the method comprising:
forming a dam structure on a plurality of dies proximate edge regions of the plurality of dies; disposing a molding material around the plurality of dies; and removing a top portion of the molding material and a top portion of the dam structure. |
| 地址 |
Hsin-Chu TW |
