| 发明名称 |
Semiconductor Structure and Method of Fabricating the Same |
| 摘要 |
A semiconductor structure and a method of fabricating the same. The semiconductor structure comprises: a layer element, one or more supporting elements disposed on a first surface of the layer element, and one or more anchoring elements disposed within the layer element and connected to the one or more supporting elements to couple the one or more supporting elements to the layer element to strengthen the layer element. |
| 申请公布号 |
US2016013139(A1) |
申请公布日期 |
2016.01.14 |
| 申请号 |
US201414769599 |
申请日期 |
2014.02.21 |
| 申请人 |
ADVANPACK SOLUTIONS PTE LTD |
发明人 |
Lim Shoa Siong Raymond;Chew Hwee Seng Jimmy |
| 分类号 |
H01L23/00;H01L21/48;H01L21/56;H01L23/495 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor structure, comprising:
a layer element; one or more supporting elements disposed on a first surface of the layer element, and one or more anchoring elements disposed within the layer element and connected to the one or more supporting elements to couple the one or more supporting elements to the layer element to strengthen the layer element. |
| 地址 |
Singapore SG |
