| 发明名称 |
CAPACITIVE MICROMACHINED ULTRASONIC TRANSDUCER PROBE USING WIRE-BONDING |
| 摘要 |
Provided are capacitive micromachined ultrasonic transducer (CMUT) probes that use wire bonding. A CMUT probe includes a CMUT chip which includes a plurality of first electrode pads which are disposed on a first surface thereof, a printed circuit board (PCB) which is disposed on the first surface of the CMUT chip and which is configured to expose the plurality of first electrode pads, a plurality of second electrode pads which are disposed on the PCB and which correspond to respective ones of the plurality of first electrode pads, and a plurality of wires which connect each respective one of the plurality of first electrode pads to the corresponding one of the plurality of second electrode pads. |
| 申请公布号 |
US2016007959(A1) |
申请公布日期 |
2016.01.14 |
| 申请号 |
US201514728341 |
申请日期 |
2015.06.02 |
| 申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KANG Sungchan;JEONG Byunggil;PARK Sangha;SHIN Hyungjae |
| 分类号 |
A61B8/00 |
主分类号 |
A61B8/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A capacitive micromachined ultrasonic transducer (CMUT) probe comprising:
a CMUT chip which comprises a plurality of first electrode pads which are disposed on a first surface thereof; a printed circuit board (PCB) which is disposed on the first surface of the CMUT chip and which is configured to expose the plurality of first electrode pads; a plurality of second electrode pads which are disposed on the PCB and which correspond to respective ones of the plurality of first electrode pads; and a plurality of wires which connect each respective one of the plurality of first electrode pads to the corresponding one of the plurality of second electrode pads. |
| 地址 |
Suwon-si KR |
