| 摘要 |
A metal base plate (1) has a through-hole (2) therein. An insulating substrate (3) is provided on the base plate (1). A semiconductor chip (4) is provided on the insulating substrate (3). A case (8) has a screw-hole (9) connected to the through-hole (2), covers the insulating substrate (3) and the semiconductor chip (4), and is provided on the base plate (1). A metal screw (11) is inserted into the through-hole (2) and the screw-hole (9), and affixes the case (8) to the base plate (1). A soft, flexible material (12) fills the cavity formed between the tip of the screw (11) and the bottom surface of the screw-hole (9) in the case (8). |
