发明名称 |
COOLING MECHANISM FOR DATA CENTER |
摘要 |
[Problem to be Solved] A technical object is to develop a novel cooling mechanism for a data center that can be operated at low running costs, can eliminate dust penetration, water droplet occurrence, and water leakage, can reduce temperature unevenness in the indoor space, and can achieve prompt fire extinction with little damage even in the case where a fire breaks out.;[Solution] Provided is a cooling mechanism for a data center, including: an evaporative condenser and a liquid receiver arranged outside of the data center; and an evaporator arranged in an indoor space of the data center. The indoor space is cooled by evaporating a refrigerant in the evaporator, and the refrigerant is condensed by the evaporative condenser. |
申请公布号 |
US2016014934(A1) |
申请公布日期 |
2016.01.14 |
申请号 |
US201414764055 |
申请日期 |
2014.02.07 |
申请人 |
HACHIYO ENGINEERING CO., LTD. ;Institute of National Colleges of Technology JAPAN |
发明人 |
SHIRAIWA Hiroyuki;KANEO Hidetoshi |
分类号 |
H05K7/20 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
1. A cooling mechanism for a data center, comprising:
an evaporative condenser and a liquid receiver arranged outside of the data center; and an evaporator arranged in an indoor space of the data center, wherein the indoor space is cooled by evaporating a refrigerant in the evaporator, and the refrigerant is condensed by the evaporative condenser. |
地址 |
Yaizu-shi, Shizuoka JP |