| 发明名称 |
A PRINTED CIRCUIT BOARD (PCB) STRUCTURE |
| 摘要 |
According to an example, a printed circuit board (PCB) structure may include a substrate having a first surface and a second surface. The PCB structure may also include a heat radiating groove formed on the first surface of the substrate. |
| 申请公布号 |
US2016014879(A1) |
申请公布日期 |
2016.01.14 |
| 申请号 |
US201314769301 |
申请日期 |
2013.11.18 |
| 申请人 |
HANGZHOU H3C TECHNOLOGIES CO., LTD. |
发明人 |
LI Yi |
| 分类号 |
H05K1/02;H05K1/18;H05K1/11 |
主分类号 |
H05K1/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A printed circuit board (PCB) structure, comprising:
a substrate having a first surface and a second surface; a heat radiating groove formed on the first surface of the substrate. |
| 地址 |
Zhejiang CN |
