发明名称 FINFET DEVICE WITH GATE OXIDE LAYER
摘要 The present disclosure provides a semiconductor structure. In accordance with some embodiments, the semiconductor structure includes a substrate, one or more fins each including a first semiconductor layer formed over the substrate, an oxide layer formed wrapping over an upper portion of each of the one or more fins, and a gate stack including a high-K (HK) dielectric layer and a metal gate (MG) electrode formed wrapping over the oxide layer. The first semiconductor layer may include silicon germanium (SiGex), and the oxide layer may include silicon germanium oxide (SiGexOy).
申请公布号 US2016013308(A1) 申请公布日期 2016.01.14
申请号 US201414328350 申请日期 2014.07.10
申请人 Taiwan Semiconductor Manufacturing Company, Ltd. 发明人 Lee Tung Ying;Huang Yu-Lien;Chang I-Ming
分类号 H01L29/78;H01L29/51;H01L29/36;H01L29/66 主分类号 H01L29/78
代理机构 代理人
主权项 1. A semiconductor device, the device comprising: a substrate; one or more fins each including a first semiconductor layer formed over the substrate; an oxide layer formed wrapping over an upper portion of each of the one or more fins; and a gate stack including a high-K (HK) dielectric layer and a metal gate (MG) electrode formed wrapping over the oxide layer, wherein the first semiconductor layer includes silicon germanium (SiGex), and wherein the oxide layer includes silicon germanium oxide (SiGexOy).
地址 Hsin-Chu TW
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