OPTOELECTRONIC DEVICE AND METHOD FOR ASSEMBLING AN OPTOELECTRONIC DEVICE

摘要

An optoelectronic device and a method for assembling an optoelectronic device are provided which obviate the need for providing additional structural elements only for aligning purposes, thus reducing the costs and effort for manufacturing the optoelectronic device. An optoelectronic substrate is mounted on a mounting surface of a mounting substrate; a coupling region of the optoelectronic device faces a reflection element. A fiber endpiece is arranged at a mounting distance from the mounting surface, the mounting distance being larger than a distance of the coupling region from the mounting surface. The mounting surface is exposed and free of any further substrates, layers or structures for mechanically connecting or contacting the optical fiber. A fiber portion which is arranged at a distance from the fiber endpiece contacts a glue droplet arranged on or above the mounting surface of the mounting substrate.

主权项

1. An optoelectronic device comprising:
a mounting substrate having a mounting surface; at least one optoelectronic substrate comprising:
a support surface, the optoelectronic substrate with its support surface being mounted at and supported by the mounting surface of the mounting substrate; andat least one optoelectronic element with a coupling region for emitting or detecting electromagnetic radiation, the coupling region being oriented parallel to the support surface and/or to the mounting surface; at least one optical fiber having a fiber endpiece; at least one reflective element for reflecting electromagnetic radiation entering or exiting the at least one optical fiber; and at least one glue droplet in a position fixed relative to the mounting surface of the mounting substrate; the glue droplet being made of a glue material or of another adhesive material; wherein each optical fiber comprises at least one fiber portion contacting and/or being immersed in the at least one glue droplet; the fiber portion being arranged at a distance from the fiber endpiece of the optical fiber; wherein the fiber endpiece is arranged at a mounting distance from the mounting surface being larger than a distance between a position of the coupling region of the optoelectronic substrate and the mounting surface; and wherein the mounting surface, with the exception of portions of the mounting surface underlying and supporting the at least one glue droplet and/or the at least one optoelectronic substrate, is exposed around the at least one optoelectronic substrate and/or the at least one glue droplet.