| 摘要 |
1,044,276. Semi-conductor devices. STANDARD TELEPHONES & CABLES Ltd. March 6, 1964 [March 13, 1963], No. 9640/64. Addition to 1,020,151. Heading H1K. In a mounting structure for a semi-conductor device which comprises an insulating disc provided with an aperture therein for accommodating a semi-conductor element and a layer of metal on each face of the disc to which the electrodes of the element are connected, the disc and the layers are sealed together only in the vicinity of the cavity, whereby unequal expansion of the materials of the disc and layers when the structure is heated do not cause the hermetic sealing of the element to be ruptured. As shown Cu or Ag layers 3, 4 are soldered to metallized portions of the faces of a ceramic disc 1 only in the region 6, the remaining space between the layers and the disc being filled with a suitable plastic mass 7. Layer 4 is preferably thicker than layer 3. |
