MEMS Device Structure and Methods of Forming Same

摘要

A microelectromechanical system (MEMS) device may include a MEMS structure above a first substrate. The MEMS structure comprising a central static element, a movable element, and an outer static element. A portion of bonding material between the central static element and the first substrate. A second substrate above the MEMS structure, with a portion of a dielectric layer between the central static element and the second substrate. A supporting post comprises the portion of bonding material, the central static element, and the portion of dielectric material.

主权项

1. A method for forming a microelectromechanical system (MEMS) device comprising:
forming a MEMS structure over a first substrate, wherein the MEMS structure comprises a movable element and a static element; forming an interconnect structure on a second substrate; depositing a first dielectric layer on the interconnect structure; and bonding the MEMS structure to the first dielectric layer, the bonding forming a cavity surrounding the movable element, the static element forming at least part of a first supporting post in the cavity, the first supporting post configured to support the second substrate.