发明名称 |
MOLDED PRINTHEAD |
摘要 |
In one example, a printhead includes: a printhead die having a front face along which fluid may be dispensed from the die, the die molded into a monolithic molding having a channel therein through which fluid may pass directly to a back part of the die, the front face of the die exposed outside the molding and the back part of the die covered by the molding except at the channel; an electrical contact exposed outside the molding to connect to circuitry external to the printhead; a printed circuit board molded into the molding, the printed circuit board having an exposed front face co-planar with and surrounding the exposed front face of the die and a conductor electrically connected to the contact; and an electrical connection between the die and the printed circuit board conductor fully encapsulated in the molding. |
申请公布号 |
US2016009086(A1) |
申请公布日期 |
2016.01.14 |
申请号 |
US201314770608 |
申请日期 |
2013.09.27 |
申请人 |
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. |
发明人 |
Choy Silam J.;Cumbie Michael W.;Mourey Devin Alexander;Chen Chien-Hua |
分类号 |
B41J2/14;B41J2/16 |
主分类号 |
B41J2/14 |
代理机构 |
|
代理人 |
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主权项 |
1. A printhead, comprising:
a printhead die having a front face along which fluid may be dispensed from the die, the die molded into a monolithic molding having a channel therein through which fluid may pass directly to a back part of the die, the front face of the die exposed outside the molding and the back part of the die covered by the molding except at the channel; an electrical contact exposed outside the molding to connect to circuitry external to the printhead; a printed circuit board molded into the molding, the printed circuit board having an exposed front face co-planar with and surrounding the exposed front face of the die and a conductor electrically connected to the contact; and an electrical connection between the die and the printed circuit board conductor. |
地址 |
Houston TX US |