发明名称 MOLDED PRINTHEAD
摘要 In one example, a printhead includes: a printhead die having a front face along which fluid may be dispensed from the die, the die molded into a monolithic molding having a channel therein through which fluid may pass directly to a back part of the die, the front face of the die exposed outside the molding and the back part of the die covered by the molding except at the channel; an electrical contact exposed outside the molding to connect to circuitry external to the printhead; a printed circuit board molded into the molding, the printed circuit board having an exposed front face co-planar with and surrounding the exposed front face of the die and a conductor electrically connected to the contact; and an electrical connection between the die and the printed circuit board conductor fully encapsulated in the molding.
申请公布号 US2016009086(A1) 申请公布日期 2016.01.14
申请号 US201314770608 申请日期 2013.09.27
申请人 HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. 发明人 Choy Silam J.;Cumbie Michael W.;Mourey Devin Alexander;Chen Chien-Hua
分类号 B41J2/14;B41J2/16 主分类号 B41J2/14
代理机构 代理人
主权项 1. A printhead, comprising: a printhead die having a front face along which fluid may be dispensed from the die, the die molded into a monolithic molding having a channel therein through which fluid may pass directly to a back part of the die, the front face of the die exposed outside the molding and the back part of the die covered by the molding except at the channel; an electrical contact exposed outside the molding to connect to circuitry external to the printhead; a printed circuit board molded into the molding, the printed circuit board having an exposed front face co-planar with and surrounding the exposed front face of the die and a conductor electrically connected to the contact; and an electrical connection between the die and the printed circuit board conductor.
地址 Houston TX US