发明名称 |
HIGH K DIELECTRIC COMPOSITION FOR THERMOFORMABLE CAPACITIVE CIRCUITS |
摘要 |
This invention is directed to a polymer thick film thermoformable dielectric composition with a high dielectric constant, comprising a urethane resin, a phenoxy resin and a powder with a high dielectric constant. Dielectrics made from the composition can be used in various electronic applications to enhance the performance of thermoformable capacitive circuits. |
申请公布号 |
WO2016007268(A1) |
申请公布日期 |
2016.01.14 |
申请号 |
WO2015US36412 |
申请日期 |
2015.06.18 |
申请人 |
E. I. DU PONT DE NEMOURS AND COMPANY |
发明人 |
DORFMAN, JAY ROBERT |
分类号 |
C08L71/00;C08L63/00;C08L75/06 |
主分类号 |
C08L71/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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