发明名称 |
AN INTEGRATED CIRCUIT MODULE WITH LEAD FRAME MICRO-NEEDLES |
摘要 |
An integrated circuit (IC) module with a lead frame micro-needle for a medical device, and methods of forming the IC module are described. The methods include forming a lead frame blank including a micro-needle integrally formed therein. The micro-needle may be bent beyond an initial lower side of the lead frame blank. The initial lower side may be joined with a protection layer such that the bent micro-needle is embedded in the protection layer, which may be removably attached to the initial lower side and the bent micro-needle. An IC component may be affixed to an upper side of the lead frame blank. The IC component and an upper surface of a core of the lead frame blank may be encapsulated with a molding compound forming a packaging of the IC module. Removal of the protection layer may expose the bent micro-needle projecting away from the packaging. |
申请公布号 |
WO2016007246(A1) |
申请公布日期 |
2016.01.14 |
申请号 |
WO2015US34149 |
申请日期 |
2015.06.04 |
申请人 |
QUALCOMM INCORPORATED |
发明人 |
KASKOUN, KENNETH;ZHANG, RONGTIAN;NOWAK, MATTHEW MICHAEL;GU, SHIQUN |
分类号 |
A61B5/00;A61B5/04;A61M37/00 |
主分类号 |
A61B5/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|