发明名称 ENCAPSULATION OF AN ORGANIC OPTOELECTRONIC COMPONENT
摘要 An encapsulated device comprising: - an organic optoelectronic component (C) having at least one so-called sensitive surface, needing to be protected from oxygen and/or water vapour; and a multilayer encapsulation structure covering at least said sensitive surface, comprising at least one layer of organic material (O) interposed between first (B1) and second (B2) barrier layers made from non-metal inorganic material impermeable to oxygen and water vapour; characterised in that said barrier layers are made from a material chosen from a stoichiometric metal oxide, stoichiometric silicon oxide and a silicon oxynitride, and produced by atomic layer deposition, and in that said multilayer encapsulation structure also comprises at least one so-called active layer (A) containing a non-stoichiometric oxide having an oxygen vacancy, also interposed between said first and second barrier layers. A method for encapsulating a component having at least one so-called sensitive surface, needing to be protected from oxygen and/or water vapour, by producing such a multilayer encapsulation structure.
申请公布号 WO2016005456(A1) 申请公布日期 2016.01.14
申请号 WO2015EP65616 申请日期 2015.07.08
申请人 COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIESALTERNATIVES;MICROOLED 发明人 BONNET, ROBIN;GILET, JEAN-MARC;MAINDRON, TONY;SIMON, JEAN-YVES
分类号 H01L51/52 主分类号 H01L51/52
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