| 摘要 |
PROBLEM TO BE SOLVED: To provide a transformer module improved in heat dissipation performance, and a power reception device comprising the same.SOLUTION: A transformer module includes a plurality of transformers that have high-voltage and low-voltage parts and that are mounted on a component side of a printed-circuit board 5, and conductor patterns 51 and 52 for heat dissipation, which are provided on the backside of the printed-circuit board 5 facing the component side. In the plurality of transformers, the low-voltage parts are connected to the conductor patterns 51 and 52 for heat dissipation. The conductor patterns 51 and 52 for heat dissipation are formed in positions not to overlap mounting electrodes 31A, 31B, 32A, 32B, 33A and 33B of a terminal of the high-voltage part in a plan view. |
