发明名称 CONDUCTIVE PASTE COPPER POWDER AND PRODUCTION METHOD OF THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a conductive paste copper powder which comprises monodisperse and spherical fine copper particles having a sharp particle size distribution and containing no coarse particle, and which can achieve thinning of a film of an electrode while avoiding a harmful effect on electrical characteristics, and a method for stably producing the conductive paste copper powder.SOLUTION: Air is blown to a solution including copper, and a complexing agent is added for complexation of the copper, and then, blowing of air is stopped, and a reductant is added for reduction and precipitation of copper particles.
申请公布号 JP2016006234(A) 申请公布日期 2016.01.14
申请号 JP20150168469 申请日期 2015.08.28
申请人 DOWA ELECTRONICS MATERIALS CO LTD 发明人 KANESHIRO MASAKI;SUENAGA SHINICHI;FUJITA HIDEFUMI;KISHIDA MINORU
分类号 B22F1/00;H01B1/00;H01B1/22;H01B5/00 主分类号 B22F1/00
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