| 摘要 |
PROBLEM TO BE SOLVED: To reduce a time for forming wiring on a substrate.SOLUTION: A light emitting diode substrate manufacturing method comprises the processes of: forming a plurality of catalyst layers on a principal surface of a resin substrate at specified intervals by continuously coating a principal surface of the resin substrate at specified intervals with an ink containing a catalyst; forming first conductive layers on the plurality of catalyst layers, respectively, by using an electroless plating method after the process of forming the plurality of catalyst layers; soldering an anode terminal of a light emitting diode on one of the first conductor layers adjacent to each other at specified intervals and soldering a cathode terminal of the light emitting diode on the other first conductive layer after the process of forming the first conductive layers, to electrically connect the first conductive layers adjacent to each other at specified intervals; and applying voltage by using an electrolytic plating method after the process of electrical connection, so as to deposit metal on the first conductive layer by using the first conductive layer as a first electrode thereby to form second conductive layers on the first conductive layers, respectively. |
