| 发明名称 |
AN ELECTRONIC SUB-ASSEMBLY, A METHOD FOR MANUFACTURING THE SAME, AND A PRINTED CIRCUIT BOARD WITH ELECTRONIC SUB-ASSEMBLY |
| 摘要 |
Electronic sub-assembly comprising a carrier layer and a mounting area with at least one electronic component, wherein the carrier layer has at least in portions a material with a low coefficient of thermal expansion to adjust the coefficient of thermal expansion of the carrier layer, and wherein at least one compensation layer is provided on the carrier layer adjacent to the installation area, on which compensation layer an electrically insulating, thermally conductive layer and at least one electrically conductive layer are provided. |
| 申请公布号 |
US2016014901(A1) |
申请公布日期 |
2016.01.14 |
| 申请号 |
US201414772329 |
申请日期 |
2014.03.11 |
| 申请人 |
SCHWEIZER ELECTRONIC AG |
发明人 |
GOTTWALD Thomas;NEUMANN Alexander |
| 分类号 |
H05K1/18;H05K3/28;H05K1/11;H05K3/42;H05K1/02;H05K3/32;H05K3/00 |
主分类号 |
H05K1/18 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An electronic sub-assembly comprising:
a carrier layer and a mounting area with at least one electronic component; the carrier layer has at least in portions a material with a low coefficient of thermal expansion to adjust the coefficient of thermal expansion of the carrier layer; and at least one compensation layer is provided on the carrier layer adjacent to the mounting area, on which compensation layer an electrically insulating, thermally conductive layer and at least one electrically conductive layer are provided. |
| 地址 |
Schramberg DE |
