| 摘要 |
PROBLEM TO BE SOLVED: To provide an encapsulation member which improves an encapsulation performance in a relatively simple configuration, and a manufacturing method of a package for an electronic component using the encapsulation member.SOLUTION: In an encapsulation member 3, a first base layer 35 formed from a copper plating layer, a first nickel plating layer 32, a first copper plating layer 33 and a first silver plating layer 34 are laminated in order at a side of one surface 31a of a metallic core material 31. Therefore, the encapsulation member 3 is heated while being pressed toward a base member 2 in the state where the encapsulation member 3 is overlapped while turning the one surface 31a of the encapsulation member 3 toward an end face 220 of a sidewall 22 of the base member 2. As a result, silver atoms and copper atoms are diffused and become a brazing material comprised of a silver-copper alloy, such that the encapsulation member 3 and the base member 2 are welded by the brazing material comprised of the silver-copper alloy. |
