发明名称 HEAT TREATMENT APPARATUS AND HEAT TREATMENT METHOD
摘要 A heat treatment apparatus includes processing chambers into which microwaves with an effective wavelength of λg are introduced. The processing chambers are arranged parallel to each other. The length from an inner wall surface of one end of each processing chamber in the lengthwise direction to an inner wall surface of the other end thereof is m×λg/2 (m being a positive integer). An antenna sending microwave oscillation into the processing chambers is separated by λg/4+p×λg/2 (p being a positive integer including 0) from the inner wall surface of the end part in the lengthwise direction of each processing chamber. The processing chambers are disposed to be offset by λg/(2×n) (n being the number of the processing chambers) from each other in the lengthwise direction, when the processing chambers are seen to overlap with each other in a perpendicular direction to the lengthwise direction of each processing chamber.
申请公布号 US2016013056(A1) 申请公布日期 2016.01.14
申请号 US201314771046 申请日期 2013.12.26
申请人 TOKYO ELECTRON LIMITED 发明人 KASAI Shigeru;MIURA Hitoshi
分类号 H01L21/02;H05B6/78;H05B6/80;H05B6/70 主分类号 H01L21/02
代理机构 代理人
主权项 1. A heat treatment apparatus, comprising: a plurality of tube-shaped processing chambers into which a microwave is introduced, the processing chambers being arranged parallel to each other and each having an opening part facing a target object, wherein the processing chambers are disposed, when the processing chambers are seen so as to overlap with each other in a perpendicular direction to a lengthwise direction of each of the processing chambers, to be offset from each other in the lengthwise direction so that phases of standing waves generated in the processing chambers do not coincide. with each other.
地址 Minato-ku, Tokyo JP